South Korea’s SK Hynix to launch US chip plant in 2023: Sources | Technology

New facility seen serving to the US compete with China within the essential semiconductor sector.

South Korea’s SK Hynix goals to pick a US website for its superior chip packaging plant and break floor there across the first quarter of subsequent 12 months, two individuals conversant in the matter stated, serving to the US to compete as China pours cash into the burgeoning sector.

The plant, whose estimated price could be “a number of billions”, would ramp as much as mass manufacturing by 2025-26 and make use of about 1,000 employees, one of many sources stated, declining to be named as a result of particulars concerning the plant haven’t been made public.

It might probably be positioned close to a college with engineering expertise, the particular person stated.

The corporate is “hoping to select of the positioning and break floor someplace across the first quarter of subsequent 12 months”, one of many individuals stated.

SK Group, South Korea’s second-biggest conglomerate, owns reminiscence chipmaker SK Hynix and introduced the brand new plant final month as a part of a $22bn US-based funding package deal in semiconductors, inexperienced power and bioscience tasks.

The announcement, heralded by the White Home, stated $15bn could be allotted to the semiconductor trade by means of analysis and improvement programmes, supplies, and the creation of a complicated packaging and testing facility.

“R&D investments will embody constructing out a nationwide community of R&D partnerships and amenities,” the supply stated, including that the packaging facility would package deal SK Hynix’s reminiscence chips with logic chips designed by different US firms for machine studying and synthetic intelligence purposes.

The corporate, following the Reuters story concerning the timing of the groundbreaking, confirmed it plans to pick a website for the plant within the first half of subsequent 12 months however stated no resolution has been made on when to start development.

New battle traces

The US way back ceded most simple, low-value chip packaging operations to abroad factories largely in Asia, the place chips are positioned into protecting frames that are then examined earlier than being shipped to electronics producers.

However new battle traces are being drawn within the race to develop superior packaging strategies, which contain inserting totally different chips with totally different features right into a single package deal, enhancing total capabilities and limiting the added price of extra superior chips.

“Whereas the US and its companions have superior packaging capabilities, China’s huge investments in superior packaging threaten to upend the market sooner or later,” the White Home stated in a 2021 report.

An govt at China’s prime chipmaker SMIC, which was added to a US commerce blacklist in 2020, stated final 12 months Chinese language firms ought to give attention to superior packaging to beat their weaknesses in creating extra refined chips, in response to the report.

SK Group’s transfer comes after Biden signed into legislation the CHIPS Act this week, offering $52bn in subsidies for chip manufacturing and analysis, in addition to an estimated $24bn funding tax credit score for chip crops. The sources stated the R&D amenities and the chip packaging plant would each qualify for the funding.

There was a flurry of growth plans introduced by chipmakers within the US lately, from Taiwan Semiconductor Manufacturing Co to Samsung Electronics and Intel.

Leave a Reply